This article examines the materials and design approaches for controlling EV battery heat, with a focus on custom thermal interface pads and heat spreaders. By improving heat conduction between cells ...

As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...

TL;DR: Thermal Grizzly introduces the Minus Pad extreme 2 and Minus Pad High Compression thermal pads, featuring improved material composition for enhanced thermal conductivity and better hardware ...

A teardown of Apple's new 40W Dynamic Power Adapter shows how Apple manages to squeeze a massive 60W charging capacity while also maintaining safety by monitoring the temperature. Apple is known for ...

New York, United States, Aug. 18, 2025 (GLOBE NEWSWIRE) -- Graphjet Technology (“Graphjet” or “the Company”) has agreed to support and collaborate with Centre for Materials Engineering and Smart ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

The M4 MacBook Air represents a remarkable blend of portability and performance, showcasing Apple’s engineering prowess. Its fanless design contributes to its sleek form factor and silent operation, ...

AI coding assistants are becoming wildly popular, with the vast majority of respondents in GitHub’s latest poll saying that they’ve adopted AI tools in some form. Y Combinator partner Jared Friedman ...

As material to replace your graphics card's old thermal pads, it does a far better job at transferring the heat away. But the price, difficult application process, and inherent risk to the card itself ...

Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...