Abstract: The packaging is a core technology in various integrated semiconductor systems, and interconnection is the key element of the packaging in providing monolithic-like performance. As the ...

Researchers at Tohoku University, working with international collaborators in France, have developed an ultrafine "soft yarn" actuator fiber capable of bending, contracting, and producing complex ...

Soft robotics has quickly moved from a niche research topic to a practical technology with real-world applications—from gentle grippers in ...

Controlling light with light is a long-sought goal for computing and communication technologies. Achieving this capability ...