A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
The star-like "kagome" structure of the molecules in this 2D metal-organic material (shown in an STM image on the left and a non-contact AFM image on the right) produces strong electronic interactions ...
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