Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 TOKYO — Global ...

To bridge the industry-academia gap and cultivate a future-ready talent pool, Maven Silicon, India’s leading VLSI and ...

At CES 2026, BOS will showcase its AI Box, an external physical AI computing module powered by Eagle-N, demonstrating a practical approach to scaling AI capabilities in vehicles without replacing ...

Prediction: IoT Analytics expects 2026 to bring wider adoption of AI-aware EDA flows and off-the-shelf AI IP subsystems in IoT chip development. These tools and IP blocks will reduce design complexity ...

As laptops, AI PCs, and the latest imaging systems demand even higher performance and lower power, SoCs are challenged to ...

SEOUL, South Korea – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interface IP solutions, announced today that it has ...

S2C, MachineWare, and Andes remain committed to advancing verification methodologies and providing scalable, efficient, and robust development tools for the RISC-V community. Together, the companies ...

BOS Semiconductors participated in AISFC 2025, Korea’s leading AI semiconductor conference, held on December 10 and hosted by ...

Intel Foundry announced that it has managed to install the world's most advanced EUV machine—ASML's TWINSCAN EXE:5200B High-NA EUV scanner—in its facilities. The company is producing its 14A node ...

Toshiba has introduced Siemens’ EDA tools to advance semiconductor design sophistication and accelerate development speed and we have begun trials to strengthen our design environment using these ...