The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, today announced the closing of a $2.1 million Seed 1 financing round in January 2026. The round was led by ...

The inevitable move to one-at-a-time wafer processing, expected to come about in the 300mm-wafer generation, is almost certain to have a dramatic impact on the manufacturing supply chain, according to ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...

TOKYO — In a major boost for silicon-on-insulator technology, Toshiba Corp. will adopt Canon Inc.'s Eltran SOI wafer process for broadband microprocessors built in 0.1-micron and 0.07-micron process ...

Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...

As OEMs expand EV platforms and 800V architectures, SiC content per vehicle rises, directly lifting wafer processing demand across substrates and epi wafers. 2) Grid modernization and renewable ...