Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...
Ironwood Electronics has released a new spring pin test socket for DFN2 packages. The socket is engineered to support up to ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...
BANGALORE, India, July 11, 2024 /PRNewswire/ -- Semiconductor Test Socket Market is Segmented by Type (Burn-in Socket, Test Socket), by Application (IC Design Company, Packaging Company, IDM, ...
Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...
Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...
Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results