Over the years, the field of VLSI circuits has witnessed remarkable advancements. One such breakthrough is the advent of 3D integration, which has revolutionized the way integrated circuits are ...
Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...
It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...
CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach for ...
DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/8l78bn/advanced) has announced the addition of the "Advanced Packaging: 3D ...
Research Triangle Park, NC – October 28, 2014: Driven by process scaling and the need for continually shrinking devices, 3D integration is poised to impact not only future semiconductor device designs ...
3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. While it has long been used for adding antennas and simple ...
Purdue faculty dedicate countless hours to exploring the frontiers of their respective fields, pushing the boundaries of knowledge and contributing to the ever-evolving landscape of academia. To ...
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